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Vendor shall deliver, install, and warranty quantity one (1) Reactive Ion Flourine Etching System (REI) as defined in the Statement of Work which includes specifications, ANL-407 Quality Requirements listed in the Statement of Work, and other documentation attached to this solicitation. The specifications listed in the statement of work reflect Argonne’s preferred construction, but minor changes can be reviewed for approval based on vendor capability.

Seeking the below capabilities:

1. Quad-port pumping system (with four pumping ports located at four corners at the chamber bottom) that allows for uniform pumping and distribution of process gases that result in superior process uniformity.


2. Adjustable electrode separation (between 25mm to 75mm) that allows for wider process window and low-pressure etching process possible.


3. Wide process pressure range - from 1Pa to 200Pa


4. Big bottom electrode diameter to permit loading till 9” wafer, or multiple wafers (for wafers of 4” diameter).


5. Touch screen system interface.


6. Four MFCs.


7. To include 500L/min dry pump with nitrogen saving feature and silencer. The silencer is very important for environmental noise.


8. Additional safety features such as two-hand chamber lid open or close.


9. Low maintenance cost. Less than $600.00 per year is ideal.

Argonne National Laboratory is committed to our environment and requests documentation related to the carbon footprint associated with this purchase.

Any questions regarding this solicitation must be submitted in writing to the Procurement personnel listed on this announcement via email at krojas@anl.gov by no later than 01/17/23.